Advanced Vacuum Coating Materials Providing High Density and Low Defect Thin Films for Electronic and Photonic Devices

Ti Time supplies custom nickel vanadium sputtering targets, also known as NiV sputtering targets, Ni-V targets or nickel vanadium alloy targets, for PVD coating, magnetron sputtering, semiconductor-related thin films, microelectronics, barrier layers, seed layers and functional thin film deposition.

Nickel vanadium targets are widely used to deposit NiV alloy films with good adhesion, stable electrical performance and barrier layer properties. A common and important composition is NiV 93/7 wt%, also known as NiV7, which is widely used in semiconductor and microelectronic thin film applications.

Compared with pure nickel targets, nickel vanadium alloy targets can provide improved sputtering behavior because the addition of vanadium helps make the alloy non-ferromagnetic, which is beneficial for magnetron sputtering processes.

Ti Time can provide planar NiV targets, round NiV targets, rectangular NiV targets, rotary NiV targets and custom-machined nickel vanadium targets according to customer drawings, samples or coating equipment requirements.

Nickel vanadium sputtering targets are used in vacuum coating systems to deposit nickel-vanadium alloy films. NiV films are commonly used in semiconductor-related processes, microelectronics, integrated circuits, barrier layers, seed layers, adhesion layers, sensors and functional thin film systems.

NiV 93/7 wt% is one of the most commonly used nickel vanadium sputtering target compositions. In semiconductor metallization, NiV films may be used as barrier layers or seed layers depending on device structure and process design.

Ti Time focuses on stable alloy composition, controlled machining accuracy and flexible customization. We can support R&D coating trials, small-batch testing and production-size target supply.

Different Ni/V ratios can be selected according to film design, barrier performance, adhesion requirement, electrical property and sputtering process.

Note: Final Ni/V ratio should be confirmed according to coating equipment, film design, electrical property, barrier requirement and customer technical specification.

The following table is a general reference for nickel vanadium sputtering targets. Final impurity limits can be adjusted according to purity grade, production process and customer specification.

Note: For semiconductor-related NiV targets, purity, metallic impurity control, grain structure, density and surface condition should be confirmed together according to the final process requirement.

Ti Time can produce nickel vanadium sputtering targets according to customer drawings or coating equipment requirements.

Ti Time can provide NiV targets according to different coating equipment and project requirements.

For quotation, customers can provide target drawings, old target photos, coating equipment model, required Ni/V ratio, purity and quantity.

Nickel vanadium sputtering targets are used in many advanced thin film applications.

NiV sputtering targets are widely used in semiconductor-related thin film processes. NiV films may function as barrier layers, seed layers or adhesion layers depending on the device structure and process design.

NiV 93/7 wt% is one of the common compositions used for semiconductor applications. For these applications, customers usually require stable composition, high purity, controlled grain structure, clean surface condition and tight dimensional tolerance.

In magnetron sputtering, pure nickel is ferromagnetic, which can influence sputtering efficiency and magnetic field distribution. Adding vanadium helps make NiV alloy non-ferromagnetic, making it more suitable for magnetron sputtering in many thin film processes.

This is one reason why NiV targets are widely used as an alternative to pure nickel targets in semiconductor-related and electronic thin film applications.

Many coating systems require non-standard target sizes, special Ni/V ratios or customized mounting structures. Ti Time can produce NiV sputtering targets according to customer drawings, samples, old target photos or coating equipment information.

Nickel vanadium targets can be supplied as standalone targets or bonded with backing plates according to coating equipment requirements. Backing plate bonding helps improve installation stability and heat transfer during sputtering operation.

The suitable bonding method should be confirmed according to target size, sputtering power, cooling design and coating equipment requirements.

Ti Time controls nickel vanadium target production from raw material selection to alloy preparation, forming, heat treatment, machining, surface inspection and final packaging. Quality control can be arranged according to customer project requirements.

Material certificates, inspection reports or other technical documents can be provided upon request.

Ti Time supplies titanium, aluminum, chromium, zirconium, molybdenum, tungsten, niobium, tantalum, nickel alloys and related sputtering targets for coating and industrial applications. For nickel vanadium sputtering targets, we focus on stable alloy ratio, clean surface condition, practical customization and clear technical communication before production.