Comprehensive Vacuum Coating Materials Selection Covering Metals Oxides and Nitrides for Various Coating Technologies
Product Details
Product Description
Ti Time supplies custom aluminum sputtering targets, also known as Al sputtering targets or aluminum targets, for PVD coating, magnetron sputtering, optical coating, semiconductor-related thin film deposition, display coating, reflective coating and functional thin film applications.
Aluminum is a lightweight, silver-white metal with good electrical conductivity, thermal conductivity and ductility. Aluminum sputtering targets are widely used to deposit aluminum films and aluminum-based thin films where reflectivity, conductivity, corrosion resistance, low density or decorative appearance are required.
Ti Time can provide round aluminum targets, rectangular aluminum targets, planar targets, rotary targets, tubular targets and custom-machined aluminum targets according to customer drawings, samples or coating equipment requirements.

Aluminum sputtering targets are used in vacuum coating systems to deposit aluminum films and aluminum-based thin films. Aluminum films are commonly used for reflective layers, conductive layers, semiconductor-related films, capacitor films, display coatings, optical coatings, decorative coatings and protective films.
Due to aluminum’s good conductivity, low density and ability to form a protective oxide layer, aluminum targets are widely used in optical, electronic, packaging, display, lighting, automotive and functional coating industries.
Ti Time focuses on stable material quality, controlled machining accuracy and flexible customization. We can support both small-batch testing and production-size target supply.
| Item | Specification |
|---|---|
| Product Name | Aluminum Sputtering Target |
| Other Names | Al Sputtering Target, Aluminum Target, Al Target |
| Material | Aluminum |
| Purity | 99.5%, 99.8%, 99.9%, 99.95%, 99.99%, 99.999% or customized |
| Density | Approx. 2.7 g/cm³ for pure aluminum |
| Melting Point | Approx. 660°C for pure aluminum |
| Boiling Point | Approx. 2500°C for pure aluminum |
| Relative Density | According to purity, process and project requirement |
| Grain Size | Customized according to target grade and manufacturing process |
| Manufacturing Process | Melting, forging, rolling, heat treatment, machining or suitable process according to specification |
| Shape | Round, rectangular, planar, plate, rotary, pipe/tube or custom shape |
| Surface Finish | Machined, ground, polished or customized |
| Application | PVD coating, magnetron sputtering, optical coating, display coating, semiconductor-related film, conductive film, reflective film, decorative coating |
| Custom Options | Purity, size, shape, tolerance, surface finish, backing plate bonding and mounting structure |

Different aluminum purity levels can be selected according to coating process, film performance and application requirements.
| Purity | Typical Feature | Common Use |
|---|---|---|
| Al 99.5% | General industrial purity | Decorative coating, protective coating and general PVD use |
| Al 99.8% | Improved purity and stable processing | Functional coating and industrial thin films |
| Al 99.9% | Common high-purity aluminum target | Reflective film, conductive film and display-related coating |
| Al 99.95% | Higher purity for improved film quality | Optical coating and electronic thin films |
| Al 99.99% | High-purity aluminum target | Semiconductor-related and precision thin film applications |
| Al 99.999% | Ultra-high purity option | Special electronic, optical and research applications |
Note: Final purity should be confirmed according to coating equipment, film design, process requirements and customer technical specification.
Ti Time can produce aluminum sputtering targets according to customer drawings or coating equipment requirements.
| Target Type | Description |
|---|---|
| Round Aluminum Target | Disc-shaped target for planar magnetron sputtering systems |
| Rectangular Aluminum Target | Flat rectangular target for large-area coating equipment |
| Planar Aluminum Target | Standard flat target for PVD and thin film deposition |
| Rotary Aluminum Target | Rotating target for selected continuous coating systems |
| Tubular Aluminum Target | Tube-shaped target for selected sputtering systems |
| Custom Aluminum Target | Produced according to drawings, samples or old target photos |

Aluminum sputtering targets are suitable for many coating and thin film applications.
| Application Area | Typical Use |
|---|---|
| Reflective Coating | Mirrors, lighting reflectors, automotive lamps and optical reflectors |
| Conductive Films | Electronic components, electrodes and conductive layers |
| Semiconductor-related Films | Metal layers and functional thin films |
| Display Coating | Flat panel display and screen-related coating processes |
| Optical Coating | Optical films, reflective layers and functional optical components |
| Capacitor Films | Thin film capacitor and electronic material applications |
| Decorative Coating | Consumer products, hardware and metallic appearance coatings |
| Protective Films | Corrosion-resistant and surface protection layers |
| Research Applications | Laboratory sputtering and thin film experiments |

Aluminum sputtering targets are widely used for reflective and optical thin film deposition. Aluminum films can provide high reflectivity under suitable vacuum coating conditions, making them useful for mirrors, lighting reflectors, automotive lamps, optical devices and selected display applications.

High-purity aluminum sputtering targets can be used in electronic and semiconductor-related thin film processes. Aluminum films may be used as conductive layers, metal electrodes or functional films depending on the process design.
For these applications, customers usually require higher purity, controlled grain structure, clean surface condition and tight dimensional tolerance.
Many coating systems require non-standard aluminum target sizes or special mounting structures. Ti Time can produce aluminum sputtering targets according to customer drawings, samples, old target photos or coating equipment information.
| Custom Option | Available Capability |
|---|---|
| Purity | 99.5%, 99.8%, 99.9%, 99.95%, 99.99%, 99.999% or customized |
| Shape | Round, rectangular, planar, rotary, tubular and custom shapes |
| Size | Diameter, length, width and thickness customized |
| Machining | Chamfers, holes, grooves, steps, threads and mounting structures |
| Surface | Machined, ground, polished or customized |
| Backing Plate | Copper, aluminum, molybdenum or other backing plates upon request |
| Packing | Protective export packaging for international shipment |

Aluminum targets can be supplied as standalone targets or bonded with backing plates according to coating equipment requirements. Backing plate bonding helps improve installation stability and heat transfer during sputtering operation.
| Bonding Option | Description |
|---|---|
| Aluminum Backing Plate | Common option for selected aluminum target assemblies |
| Copper Backing Plate | Used when improved heat transfer is required |
| Molybdenum Backing Plate | Used for selected special coating systems |
| Indium Bonding | Suitable for some sputtering target assemblies |
| Elastomer Bonding | Available according to equipment and project requirements |
| Custom Bonding | Produced according to drawings or old target samples |
The suitable bonding method should be confirmed according to target size, sputtering power, cooling design and coating equipment requirements.
Ti Time controls aluminum target production from raw material selection to forming, deformation processing, machining, surface inspection and final packaging. Quality control can be arranged according to customer project requirements.
| Inspection Item | Purpose |
|---|---|
| Chemical Composition | Confirm aluminum purity and impurity level |
| Grain Structure | Support stable sputtering performance and film quality |
| Dimension Check | Confirm size, tolerance and mounting structure |
| Surface Inspection | Check surface finish and visible defects |
| Bonding Inspection | Confirm bonding quality when backing plate is required |
| Packing Inspection | Reduce scratches, oxidation and damage during export transportation |
Material certificates, inspection reports or other technical documents can be provided upon request.

Ti Time supplies titanium, aluminum, chromium, zirconium, molybdenum, tungsten, niobium, tantalum and related alloy sputtering targets for coating and industrial applications. For aluminum sputtering targets, we focus on high-purity material selection, clean surface condition, practical customization and clear technical communication before production.
| Ti Time Advantage | What It Means for Customers |
|---|---|
| Multiple Purity Options | 99.5% to 99.999% aluminum targets available |
| Flexible Target Shapes | Round, rectangular, planar, rotary, tubular and custom targets |
| Drawing-based Machining | Suitable for non-standard coating equipment |
| Backing Plate Support | Bonding options available upon request |
| R&D and Production Supply | Small quantity testing and batch supply available |
| Export Packaging | Suitable for international shipment |
An aluminum sputtering target is an aluminum material used in PVD or magnetron sputtering systems to deposit aluminum films and aluminum-based thin films.
Aluminum targets are commonly used for reflective coating, conductive film, semiconductor-related film, display coating, optical coating, capacitor film, decorative coating and protective coating.
Ti Time can supply aluminum sputtering targets with purity options such as 99.5%, 99.8%, 99.9%, 99.95%, 99.99% and 99.999%, depending on project requirements.
Yes. Round, rectangular, planar, rotary, tubular and custom aluminum targets can be produced according to drawings, samples or coating equipment requirements.
Yes. Aluminum targets can be bonded with aluminum, copper, molybdenum or other backing plates according to customer equipment requirements. The bonding method can be confirmed according to target size, sputtering power, cooling design and coating system.
Yes. Aluminum targets are widely used for reflective and optical coating applications, including mirrors, lighting reflectors, automotive lamps and selected display or optical components.
Yes. High-purity aluminum targets can be used in semiconductor-related thin film processes. Final specification should be confirmed according to purity, grain structure, surface condition and process requirements.
Please provide aluminum purity, target size, shape, quantity, drawing if available, surface requirement, bonding requirement and coating application. Old target photos or coating equipment information are also helpful.
Ti Time supplies custom aluminum sputtering targets for PVD coating, magnetron sputtering, reflective coating, conductive film, optical coating, display coating and semiconductor-related thin film applications. Send us your target size, purity, drawing, coating equipment model or application requirements, and we will help confirm a suitable aluminum target solution.
Ti Time supplies custom aluminum sputtering targets for PVD, reflective coating, conductive film, optical coating, display and semiconductor-related thin films. Round, rectangular, rotary, tubular and custom Al targets are available with different purity, sizes and bonding options.
Product Highlights
Aluminum Sputtering Target Ti Time supplies custom aluminum sputtering targets, also known as Al sputtering targets or aluminum targets, for PVD coating, magnetron sputtering, optical coating, semiconductor-related thin film deposition, display coating, reflective coating and functional thin film ...
Versatile Vacuum Coating Materials Compatible with Magnetron Sputtering Electron Beam Evaporation Techniques
Nickel Copper Sputtering Target Ti Time supplies custom nickel copper sputtering targets , also known as NiCu sputtering targets , Ni-Cu targets or nickel copper alloy targets , for PVD coating, magnetron sputtering, electronic thin films, protective coatings, resistive films, conductive layers and functional thin film deposition. Nickel copper targets are used to deposit NiCu alloy films with good corrosion resistance, stable electrical properties, good adhesion and
Durable Vacuum Coating Materials That Enhance Surface Hardness and Chemical Resistance in Industrial Equipment
Graphite Sputtering Target Ti Time supplies custom graphite sputtering targets , also known as carbon sputtering targets , C sputtering targets or graphite targets , for PVD coating, magnetron sputtering, DLC coating, amorphous carbon films, optical coating, semiconductor-related thin films and protective coating applications. Graphite sputtering targets are used to deposit carbon-based thin films with good chemical stability, wear resistance, low friction and functional film
Advanced Vacuum Coating Materials Providing High Density and Low Defect Thin Films for Electronic and Photonic Devices
Nickel Vanadium Sputtering Target Ti Time supplies custom nickel vanadium sputtering targets , also known as NiV sputtering targets , Ni-V targets or nickel vanadium alloy targets , for PVD coating, magnetron sputtering, semiconductor-related thin films, microelectronics, barrier layers, seed layers and functional thin film deposition. Nickel vanadium targets are widely used to deposit NiV alloy films with good adhesion, stable electrical performance and barrier layer
Innovative Vacuum Coating Materials Ensuring Excellent Corrosion Resistance and Wear Protection for Industrial Equipment and Tools
Zirconium Sputtering Target Ti Time supplies custom zirconium sputtering targets , also known as Zr sputtering targets or zirconium targets , for PVD coating, magnetron sputtering, hard coating, decorative coating, glass coating and functional thin film deposition. Zirconium is a strong and corrosion-resistant metal with good ductility, toughness and high-temperature stability. Zirconium-based coatings, including zirconium nitride and zirconium carbide coatings, can be used
Please use our online inquiry contact form below if you have any questions, our team will get back to you as soon as possible.