Tantalum Sputtering Target Manufacturer | High Purity Ta Target for PVD Coating
Product Details
Product Description
Tantalum Sputtering Target for Semiconductor Thin Films and Functional Coating
Ti Time supplies custom tantalum sputtering targets, also known as Ta sputtering targets, tantalum targets or Ta PVD targets, for PVD coating, magnetron sputtering, semiconductor-related thin film deposition, integrated circuits, optical coating, glass coating, magnetic storage, optical communication and functional thin film applications.
Tantalum is a high-density refractory metal with excellent corrosion resistance, high melting point, low vapor pressure and good chemical stability. Tantalum sputtering targets are widely used to deposit tantalum films, tantalum nitride films, tantalum oxide films and tantalum-based functional thin films where stable film quality, uniformity and reliable performance are required.
- Custom tantalum sputtering targets for PVD coating and magnetron sputtering
- Suitable for semiconductor-related films, barrier layers, adhesion layers and functional metal films
- Purity options include 99.9%, 99.95%, 99.99%, 99.995% or customized
- Pure Ta, Ta-W, Ta-Si, Ta-N, Ta₂O₅ and custom tantalum-based targets available
Key Features
High-purity tantalum targets can be selected according to semiconductor-related, optical, magnetic storage and functional thin film requirements.
Tantalum and tantalum-based films can be used as diffusion barrier layers, adhesion layers, electrode-related layers or functional metal films.
Relative density, grain size, surface roughness and target microstructure can be controlled according to coating process requirements.
Round, rectangular, planar, rotary and custom Ta targets with holes, grooves, chamfers and backing plate bonding are available.
Product Specifications
| Product Name | Tantalum Sputtering Target |
| Other Names | Ta Sputtering Target, Tantalum Target, Ta Target, Tantalum PVD Target |
| Material | Pure tantalum, tantalum alloy or tantalum-based compound |
| Purity | 99.9%, 99.95%, 99.99%, 99.995% or customized |
| Target Options | Pure Ta, Ta-W, Ta-Si, Ta-N, Ta₂O₅ or customized tantalum-based target |
| Relative Density | ≥99% or according to project requirement |
| Grain Size | ≤100 μm or customized according to grade and process |
| Surface Roughness | Ra ≤1.6 μm or customized |
| Density | Approx. 16.68 g/cm³ for pure tantalum |
| Melting Point | Approx. 2980°C for pure tantalum |
| Manufacturing Process | Vacuum melting, electron beam melting, forging, rolling, annealing, machining or suitable process according to specification |
| Target Shape | Round, rectangular, planar, rotary or custom-machined shape |
| Surface Finish | Machined, ground, polished or customized |
| Machining Options | Chamfers, holes, grooves, steps, threaded holes and mounting structures |
| Backing Plate | Copper backing plate, molybdenum backing plate or custom backing plate available |
| Application | PVD coating, semiconductor-related thin film, integrated circuits, optical coating, glass coating, magnetic storage and functional thin film deposition |
Suitable For
- PVD coating
- Magnetron sputtering
- Semiconductor-related thin films
- Integrated circuits
- Barrier and adhesion layers
- Optical coating
- Magnetic storage media
- Functional thin film deposition
Tantalum Target Material Options
In addition to pure tantalum sputtering targets, Ti Time can support tantalum alloy and tantalum-based compound targets according to customer film design and coating process requirements. Final material selection should be confirmed according to target composition, film application, sputtering process and technical specification.
| Target Type | Typical Feature | Common Use |
| Pure Tantalum Target | High purity, high density and stable film quality | Semiconductor-related films, optical coating, magnetic storage and functional thin films |
| Ta-W Target | Improved high-temperature strength and stability | Special functional thin film applications and high-stability coating systems |
| Ta-Si Target | Tantalum-silicon thin film material | Semiconductor-related and special coating systems |
| Ta-N Target | Tantalum nitride thin film material | Barrier layer, resistor film and functional thin film applications |
| Ta₂O₅ Target | Tantalum oxide thin film material | Optical coating, dielectric film and functional oxide films |
| Custom Ta-Based Target | Composition adjusted by project requirement | Special coating process or customer-defined film design |
Please provide target composition, purity, film application, process requirement, target size and drawing before final production.
Round, rectangular, planar, rotary and custom tantalum sputtering targets are available.
Available Tantalum Sputtering Target Shapes
Different PVD coating systems require different tantalum target structures. Ti Time can produce tantalum targets according to planar magnetron sputtering equipment, rotary coating systems, semiconductor-related coating equipment, glass coating systems or non-standard coating machines.
Applications of Tantalum Sputtering Targets
Tantalum sputtering targets are used to deposit tantalum films and tantalum-based functional films. They are widely used in semiconductor-related thin film processes, integrated circuits, optical coating, glass coating, flat panel displays, optical communication, magnetic storage media and research coating applications.
Used for barrier layers, adhesion layers, electrode-related layers and functional metal films.
Used in IC-related tantalum and tantalum-based thin film processes.
Used in optical components, optical thin films and selected dielectric film systems.
Used in data storage-related thin film structures and magnetic storage applications.
Used for functional glass coating, display coating and related thin film development.
Small-size Ta targets can be supplied for laboratory sputtering and thin film experiments.
Tantalum Targets for Semiconductor Applications
High-purity tantalum sputtering targets can be used in semiconductor-related thin film processes. Tantalum and tantalum-based films may be used as diffusion barrier layers, adhesion layers, electrode-related layers or functional metal films depending on the process design.
For semiconductor-related applications, customers usually require higher purity, stable density, controlled grain structure, clean surface condition, tight dimensional tolerance and suitable backing plate bonding.
Tantalum Targets for Optical and Functional Coating
Tantalum targets can also be used in optical coating, glass coating, flat panel display and functional thin film deposition. Tantalum-based films are selected where corrosion resistance, chemical stability, optical performance, dielectric performance or special electrical properties are required.
| Application Area | Typical Use |
| Optical Components | Optical thin films, functional coatings and selected dielectric film structures |
| Functional Glass | Automotive glass, architectural glass and special glass coating systems |
| Display Coating | Flat panel display thin films and related coating development |
| Optical Communication | Thin film materials for optical communication components |
| Functional Film Research | Tantalum, tantalum nitride and tantalum oxide film development |
Custom Tantalum Sputtering Targets
Many coating systems require non-standard tantalum target sizes, target compositions, strict surface requirements or special mounting structures. Ti Time can produce tantalum sputtering targets according to customer drawings, samples, old target photos or coating equipment information.
| Custom Item | Available Capability |
| Material | Pure Ta, Ta alloy or tantalum-based compound target |
| Purity | 99.9%, 99.95%, 99.99%, 99.995% or customized |
| Shape | Round, rectangular, planar, rotary and custom shapes |
| Size | Diameter, length, width and thickness customized |
| Machining | Chamfers, holes, grooves, steps, threaded holes and mounting structures |
| Surface | Machined, ground, polished or customized surface finish |
| Density / Grain Size | Controlled according to project requirement when specified |
| Backing Plate | Copper, molybdenum or other backing plates upon request |
Backing Plate Bonding
Tantalum targets can be supplied as standalone targets or bonded with backing plates according to coating equipment requirements. Backing plate bonding helps improve installation stability and heat transfer during sputtering operation.
| Bonding Option | Description |
| Copper Backing Plate | Common option for heat transfer and equipment compatibility |
| Molybdenum Backing Plate | Used for selected high-temperature or special coating systems |
| Indium Bonding | Suitable for some sputtering target assemblies |
| Elastomer Bonding | Available according to equipment and project requirements |
| Custom Bonding | Produced according to drawings or old target samples |
The suitable bonding method should be confirmed according to target size, sputtering power, cooling design and coating equipment requirements.
How to Choose a Tantalum Sputtering Target
To select the correct tantalum sputtering target, customers should confirm the coating application, target composition, purity, density, grain size, target shape, size, surface finish, backing plate requirement and coating equipment structure.
Semiconductor-related thin film, barrier layer, optical coating, magnetic storage or functional film.
Select pure Ta, Ta-W, Ta-Si, Ta-N, Ta₂O₅ or custom tantalum-based material.
Select 99.9%, 99.95%, 99.99%, 99.995% or project-specific purity according to coating requirement.
Round, rectangular, planar, rotary or special-shaped target according to equipment structure.
Target size, holes, grooves, chamfers, surface roughness and mounting structure should be confirmed.
Check whether copper backing plate, molybdenum backing plate or bonding service is needed.
Quality Control & Export Packaging
Ti Time controls tantalum sputtering target production from raw material selection to melting, forging, rolling, machining, surface inspection and final packaging. Material certificates, inspection reports or other technical documents can be provided according to customer requirements.
Inspection & Packaging Support
FAQ
A tantalum sputtering target is a tantalum material used in PVD or magnetron sputtering systems to deposit tantalum films and tantalum-based thin films.
Tantalum targets are commonly used for semiconductor-related thin films, integrated circuits, barrier layers, adhesion layers, optical coating, flat panel displays, magnetic storage, optical communication and functional thin film deposition.
Ti Time can supply tantalum sputtering targets with purity options such as 99.9%, 99.95%, 99.99% and 99.995%, depending on project requirements.
Yes. Round, rectangular, planar, rotary and custom tantalum targets can be produced according to drawings, samples or coating equipment requirements.
Yes. Tantalum targets can be bonded with copper, molybdenum or other backing plates according to customer equipment requirements. The bonding method can be confirmed according to target size, sputtering power, cooling design and coating system.
Yes. High-purity tantalum targets can be used in semiconductor-related thin film processes. Final specification should be confirmed according to purity, density, grain size, surface condition and process requirements.
Yes. Ti Time can support pure tantalum, Ta-W, Ta-Si, Ta-N, Ta₂O₅ and other tantalum-based target materials according to customer requirements.
Please provide tantalum purity or target composition, target size, shape, quantity, drawing if available, density requirement, grain size requirement, surface requirement, bonding requirement and coating application. Old target photos or coating equipment information are also helpful.
Need Custom Tantalum Sputtering Targets?
Send us your tantalum target size, purity or composition, density requirement, grain size requirement, drawing, coating equipment model, surface finish, backing plate requirement and application. Our team will help confirm a suitable Ta sputtering target solution for your PVD coating or magnetron sputtering system.
Contact Ti Time for custom tantalum sputtering targets for semiconductor-related thin films, integrated circuits, optical coating, magnetic storage, glass coating and functional thin film deposition.
Product Highlights
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