vacuum coating materials tungsten sputtering targets for microelectronics glass display solar cell and functional coating uses
Product Details
Product Description
Tungsten Sputtering Target for Semiconductor Thin Films and Functional Coating
Ti Time supplies custom tungsten sputtering targets, also known as W sputtering targets, tungsten targets or tungsten PVD targets, for PVD coating, magnetron sputtering, semiconductor-related thin film deposition, microelectronics, glass coating, display coating, solar cells and functional coating applications.
Tungsten has a high melting point, high density, good hardness and excellent high-temperature stability. Tungsten sputtering targets are widely used to deposit tungsten films and tungsten-based functional films where thermal stability, electrical performance, density and wear resistance are required.
- Custom tungsten sputtering targets for PVD coating and magnetron sputtering
- Purity options include 99.9%, 99.95%, 99.97%, 99.99% or customized
- Round, rectangular, planar, rotary and custom-machined tungsten targets available
- Density, grain size, surface roughness, machining and backing plate bonding can be customized
Key Features
Tungsten purity can be selected according to thin film application, sputtering process and customer technical specification.
High-density tungsten targets support stable sputtering performance for semiconductor-related, glass and functional coating applications.
Grain size and microstructure can be controlled according to target grade, process route and project requirements.
Round, rectangular, planar, rotary and custom tungsten targets with holes, grooves, chamfers and backing plate bonding are available.
Product Specifications
| Product Name | Tungsten Sputtering Target |
| Other Names | W Sputtering Target, Tungsten Target, W Target, Tungsten PVD Target |
| Material | Tungsten |
| Purity | 99.9%, 99.95%, 99.97%, 99.99% or customized |
| Relative Density | ≥99% or according to project requirement |
| Grain Size | ≤100 μm or customized according to grade and process |
| Surface Roughness | Ra ≤1.6 μm or customized |
| Manufacturing Process | Powder metallurgy, hot isostatic pressing, rolling, forging, machining or suitable process according to specification |
| Target Shape | Round, rectangular, planar, rotary or custom-machined shape |
| Surface Finish | Machined, ground, polished or customized |
| Machining Options | Chamfers, holes, grooves, steps, threaded holes and mounting structures |
| Backing Plate | Copper backing plate, molybdenum backing plate or custom backing plate available |
| Application | PVD coating, semiconductor-related thin film, microelectronics, glass coating, display coating, solar cell and functional thin film deposition |
Suitable For
- PVD coating
- Magnetron sputtering
- Semiconductor-related thin films
- Microelectronics
- Glass coating
- Flat panel display coating
- Solar cell thin films
- Functional thin film deposition
Round, rectangular, planar, rotary and custom tungsten sputtering targets are available.
Available Tungsten Sputtering Target Shapes
Different PVD and magnetron sputtering systems require different tungsten target structures. Ti Time can produce tungsten targets according to planar magnetron sputtering equipment, rotary coating systems, semiconductor-related coating equipment, glass coating systems or non-standard coating machines.
Purity, Density and Grain Size Selection
Tungsten sputtering target selection should be based on film application, purity requirement, relative density, grain size, target shape, surface finish and sputtering equipment design. For semiconductor-related, microelectronics and functional thin film applications, stable purity, density and surface condition are especially important.
| Item | Typical Option | Common Use |
| 99.9% Tungsten | Practical high-purity option | General PVD coating, glass coating and industrial functional films |
| 99.95% Tungsten | Higher purity for stricter film requirements | Microelectronics, display coating and functional thin film deposition |
| 99.97% / 99.99% Tungsten | High-purity tungsten target option | Semiconductor-related thin films, research coating and special applications |
| Relative Density | ≥99% or according to project requirement | Stable sputtering performance and consistent target erosion |
| Grain Size | ≤100 μm or customized | Selected coating systems requiring controlled microstructure |
Please provide purity, density requirement, grain size requirement, target size, drawing, coating application and backing plate requirement before final production.
Applications of Tungsten Sputtering Targets
Tungsten sputtering targets are used to deposit tungsten films and tungsten-based functional films. They are widely used in semiconductor-related thin film processes, microelectronics, flat panel displays, solar cells, glass coating, X-ray tubes, medical equipment and industrial functional coating applications.
Used for tungsten films, barrier layers, conductive layers and related process development.
Used in electronic components, integrated circuit-related films and device coating processes.
Used for display-related functional thin film deposition and coating development.
Used for automotive glass, architectural glass and selected functional glass coating systems.
Used for photovoltaic thin film deposition and selected functional coating layers.
Used in selected high-density, high-temperature and radiation-related material applications.
Tungsten Targets for Semiconductor and Microelectronics
High-purity tungsten sputtering targets can be used in semiconductor-related and microelectronic thin film processes. Tungsten films may be used as conductive layers, barrier layers or functional metal films depending on the process design.
For semiconductor-related applications, customers usually require higher purity, stable density, controlled grain structure, clean surface condition, tight dimensional tolerance and suitable backing plate bonding.
Tungsten Targets for Glass Coating and Functional Films
Tungsten targets can also be used in glass coating, display coating, solar cell coating and industrial functional film applications. Tungsten-based films may be selected where high-temperature stability, density, wear resistance, electrical performance or special functional properties are required.
| Application Area | Typical Use |
| Automotive Glass | Functional glass coating and selected heat-control coating systems |
| Architectural Glass | Large-area functional thin film coating and building glass coating systems |
| Flat Panel Display | Display-related functional film deposition and coating development |
| Solar Cells | Photovoltaic thin film deposition and functional layer development |
| Industrial Functional Films | Wear-resistant, high-temperature or special electrical property coatings |
Custom Tungsten Sputtering Targets
Many coating systems require non-standard tungsten target sizes, strict surface requirements or special mounting structures. Ti Time can produce tungsten sputtering targets according to customer drawings, samples, old target photos or coating equipment information.
| Custom Item | Available Capability |
| Shape | Round, rectangular, planar, rotary and custom shapes |
| Size | Diameter, length, width and thickness customized |
| Machining | Chamfers, holes, grooves, steps, threaded holes and mounting structures |
| Surface | Machined, ground, polished or customized surface finish |
| Density / Grain Size | Controlled according to project requirement when specified |
| Backing Plate | Copper, molybdenum or other backing plates upon request |
Backing Plate Bonding
Tungsten targets can be supplied as standalone targets or bonded with backing plates according to coating equipment requirements. Backing plate bonding helps improve installation stability and heat transfer during sputtering operation.
| Bonding Option | Description |
| Copper Backing Plate | Common option for heat transfer and coating equipment compatibility |
| Molybdenum Backing Plate | Used for selected high-temperature or special coating systems |
| Indium Bonding | Suitable for some sputtering target assemblies |
| Elastomer Bonding | Available according to equipment and project requirements |
| Custom Bonding | Produced according to drawings or old target samples |
How to Choose a Tungsten Sputtering Target
To select the correct tungsten sputtering target, customers should confirm the coating application, purity, density, grain size, target shape, size, surface finish, backing plate requirement and coating equipment structure.
Semiconductor-related thin film, microelectronics, glass coating, display coating, solar cell or functional film.
Select 99.9%, 99.95%, 99.97%, 99.99% or project-specific purity according to film requirement.
Relative density should match the sputtering process and target performance requirement.
Controlled grain size may be required for stricter thin film deposition systems.
Target shape, holes, grooves, chamfers, surface roughness and mounting structure should be confirmed.
Check whether copper backing plate, molybdenum backing plate or bonding service is needed.
Quality Control & Export Packaging
Ti Time controls tungsten sputtering target production from raw material selection to powder metallurgy, forming, sintering, machining, surface inspection and final packaging. Material certificates, inspection reports or other technical documents can be provided according to customer requirements.
Inspection & Packaging Support
FAQ
A tungsten sputtering target is a tungsten material used in PVD or magnetron sputtering systems to deposit tungsten films and tungsten-based thin films.
Tungsten targets are commonly used for semiconductor-related thin films, microelectronics, flat panel displays, solar cells, glass coating, X-ray tubes, medical equipment and functional thin film deposition.
Ti Time can supply tungsten sputtering targets with purity options such as 99.9%, 99.95%, 99.97% and 99.99%, depending on project requirements.
Yes. Round, rectangular, planar, rotary and custom tungsten targets can be produced according to drawings, samples or coating equipment requirements.
Yes. Tungsten targets can be bonded with copper, molybdenum or other backing plates according to customer equipment requirements. The bonding method can be confirmed according to target size, sputtering power, cooling design and coating system.
Yes. High-purity tungsten targets can be used in semiconductor-related thin film processes. Final specification should be confirmed according to purity, density, grain size, surface condition and process requirements.
Please provide tungsten purity, target size, shape, quantity, drawing if available, density requirement, grain size requirement, surface finish, backing plate requirement and coating application. Old target photos or coating equipment information are also helpful.
Need Custom Tungsten Sputtering Targets?
Send us your tungsten target size, purity, density requirement, grain size requirement, drawing, coating equipment model, surface finish, backing plate requirement and application. Our team will help confirm a suitable W sputtering target solution for your PVD coating or magnetron sputtering system.
Contact Ti Time for custom tungsten sputtering targets for semiconductor-related thin films, microelectronics, glass coating, display coating, solar cells and functional thin film deposition.
Product Highlights
Tungsten Sputtering Target for Semiconductor Thin Films and Functional Coating Ti Time supplies custom tungsten sputtering targets, also known as W sputtering targets, tungsten targets or tungsten PVD targets, for PVD coating, magnetron sputtering, semiconductor-related thin film deposition, ...
Versatile Vacuum Coating Materials Compatible with Magnetron Sputtering Electron Beam Evaporation Techniques
Nickel Copper Sputtering Target Ti Time supplies custom nickel copper sputtering targets , also known as NiCu sputtering targets , Ni-Cu targets or nickel copper alloy targets , for PVD coating, magnetron sputtering, electronic thin films, protective coatings, resistive films, conductive layers and functional thin film deposition. Nickel copper targets are used to deposit NiCu alloy films with good corrosion resistance, stable electrical properties, good adhesion and
Durable Vacuum Coating Materials That Enhance Surface Hardness and Chemical Resistance in Industrial Equipment
Graphite Sputtering Target Ti Time supplies custom graphite sputtering targets , also known as carbon sputtering targets , C sputtering targets or graphite targets , for PVD coating, magnetron sputtering, DLC coating, amorphous carbon films, optical coating, semiconductor-related thin films and protective coating applications. Graphite sputtering targets are used to deposit carbon-based thin films with good chemical stability, wear resistance, low friction and functional film
Advanced Vacuum Coating Materials Providing High Density and Low Defect Thin Films for Electronic and Photonic Devices
Nickel Vanadium Sputtering Target Ti Time supplies custom nickel vanadium sputtering targets , also known as NiV sputtering targets , Ni-V targets or nickel vanadium alloy targets , for PVD coating, magnetron sputtering, semiconductor-related thin films, microelectronics, barrier layers, seed layers and functional thin film deposition. Nickel vanadium targets are widely used to deposit NiV alloy films with good adhesion, stable electrical performance and barrier layer
Innovative Vacuum Coating Materials Ensuring Excellent Corrosion Resistance and Wear Protection for Industrial Equipment and Tools
Zirconium Sputtering Target Ti Time supplies custom zirconium sputtering targets , also known as Zr sputtering targets or zirconium targets , for PVD coating, magnetron sputtering, hard coating, decorative coating, glass coating and functional thin film deposition. Zirconium is a strong and corrosion-resistant metal with good ductility, toughness and high-temperature stability. Zirconium-based coatings, including zirconium nitride and zirconium carbide coatings, can be used
Please use our online inquiry contact form below if you have any questions, our team will get back to you as soon as possible.
